Robust Finite Element Model for the Design of Thermoelectric Modules-Reference-Cited by-同舟云学术

Robust Finite Element Model for the Design of Thermoelectric Modules

Published:2010-02-04 Issue:9 Volume:39 Page:1848-1855
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Sandoz-Rosado Emil,Stevens Robert

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-010-1077-8.pdf

Reference9 articles.

1. P.G. Lau and R.J. Buist, Proceedings of 16th International Conference on Thermoelectrics (Dresden, Germany: IEEE, 1997), p. 563.

2. E.E. Antonova and D.C. Looman, Proceedings of 24th International Conference on Thermoelectrics (Clemson, SC: IEEE, 2005), p. 215.

3. A. Rodriguez, J.G. Vian, D. Astrain, and A. Martinez, Proceedings of 25th International Conference on Thermoelectrics (Vienna, Austria: IEEE, 2006), p. 5.

4. M.S. El-Genk and H.H. Saber, AIP Conference Proceedings Edition 608 (Albuquerque, NM, 2002), p. 980.

5. H.H. Saber and M.S. El-Genk, AIP Conference Proceedings Edition 608 (Albuquerque, NM, 2002), p. 998.

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