Metal Additive Microfabrication of System-in-Package with Embedded Microfluidic Thermal Management for Heterogeneous Integration with Semiconductor Dies-Reference-Cited by-同舟云学术

Metal Additive Microfabrication of System-in-Package with Embedded Microfluidic Thermal Management for Heterogeneous Integration with Semiconductor Dies

Published:2023-02-01 Issue: Volume: Page:
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Lohani Bhushan^ORCID,Hossain Sheikh Dobir,Roberts Robert C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-023-10256-6.pdf

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