Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness-Reference-Cited by-同舟云学术

Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

Published:2005-05 Issue:5 Volume:34 Page:559-563
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jung Jung-Kyu,Hwang Nong-Moon,Park Young-Joon,Joo Young-Chang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0065-x.pdf

Reference33 articles.

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4. T.N. Theis, IBM J. Res. Development 44, 379 (2000).

5. J.D. Plummer, M. Deal, and P.B. Griffin, Silicon VLSI Technology: Fundamentals, Practice and Modeling (Upper Saddle River, NJ: Prentice-Hall, 2000), pp. 779–780.

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