A study of moisture diffusion in plastic packaging-Reference-Cited by-同舟云学术

A study of moisture diffusion in plastic packaging

Published:2002-05 Issue:5 Volume:31 Page:449-455
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Cai Xia,Huang Weidong,Xu Bulu,Kaltenpoth Gisela,Cheng Zhaonian

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0099-2.pdf

Reference17 articles.

1. S. Luo, J. Leisen, and C.P. Wong, Proc. of 4th Int. Symp. on Electronic Packaging Technology (Piscataway, NJ: IEEE, 2001) p. 133.

2. J.H. Wu, N.S. Fang, and J.C. Lu, 1st Int. Symp. on High Density Packaging & Component Failure Analysis in Electronics Manufacturing (Piscataway, NJ: IEEE, 1998) p. 13.

3. W. Tong and A. Teng, Proc. Int. Symp. on Electronic Materials and Packaging (Piscataway, NJ: IEEE, 2000) p. 464.

4. K. Yamamoto, Jpn. J. Appl. Phys. 34, 2043 (1995).

5. T.C. Wong and L.J. Broutman, Polymer Eng. Sci. 25, 529 (1985).

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition: Plastic Package Degradation, Speciation of Nano-TiO2, and Environmental Impact Assessment;Engineering;2023-05

2. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms;Materials;2019-02-12

3. The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds;Journal of Electronic Packaging;2017-07-10

4. Popcorning-type cracking failure in thermohyperelastic packaging materials in the presence of “wet” and “dry” cavities;Science China Physics, Mechanics and Astronomy;2013-01-28

5. Failure Analysis - What?;Failure Analysis;2011-04-26