Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics-Reference-Cited by-同舟云学术

Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics

Published:2001-10 Issue:10 Volume:30 Page:1303-1307
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jung Kang,Conrad Hans

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0115-y.pdf

Reference19 articles.

1. O.N. Senkov and M.M. Myshyaev, Acta Metall. 34, 97 (1986).

2. K. Okazaki, M. Momochi, and H. Conrad, Titanium Science and Technology, Vol. 3, ed. R.I. Jaffee and H.M. Burte (New York: Plenum Publ. Co., 1973), pp. 1649–1660; Trans. Jpn. Inst. Metals 14, 202 and 14, 208 (1973).

3. P.L. Hacke, A.F. Sprecher, and H. Conrad, Creep and Stress Relaxation in Miniature Structures and Components, ed. H.D. Merchant (Warrendale, PA: TMS, 1997), pp. 217–230.

4. J. Askill, Tracer Diffusion Data (New York: Plenum, 1976).

5. K.N. Tu and D. Turnbull, Scripta Metall. 1, 173 (1967).

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