The H2 plasma treatment of silver contacts: Impact on wire-bonding performance-Reference-Cited by-同舟云学术

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The H2 plasma treatment of silver contacts: Impact on wire-bonding performance

Published:2002-12 Issue:12 Volume:31 Page:1316-1320
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Bielmann M.,Ruffieux P.,Schwaller P.,Sudan P.,Schlapbach L.,Gröning P.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0114-7.pdf

Reference23 articles.

1. A. Carrass and V.P. Jaecklin, DVS 173, 135 (1991).

2. B.N.J. Persson, Sliding Friction, 2nd ed. (Berlin: Springer, 2000).

3. H.S. Kong and M.F. Ashby, MRS Bull. 16, 41 (1991).

4. H.S. Nalwa, Handbook of Thin Film Materials Volume 1: Deposition and Processing of Thin Films (San Diego, CA: Academic Press, 2002).

5. A. Grill, Cold Plasma in Materials Fabrication (New York: IEEE Press, 1993).

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1. Controlling surface morphology and sensitivity of granular and porous silver films for surface-enhanced Raman scattering, SERS;Beilstein Journal of Nanotechnology;2018-11-07

2. Fluxless soldering;International Materials Reviews;2006-10

3. The Joining Environment;Principles of Soldering;2004-04-01

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