Characterization of electroplated bismuth-tin alloys for electrically conducting materials-Reference-Cited by-同舟云学术

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Characterization of electroplated bismuth-tin alloys for electrically conducting materials

Published:2000-10 Issue:10 Volume:29 Page:1278-1283
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kang S. K.,Buchwalter S.,Tsang C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-000-0025-4.pdf

Reference11 articles.

1. S.K. Kang, R.S. Rai, and S. Purushothaman, IEEE Trans. Comp. Pkg. Mfg Technol., Part A, 21, 18 (1998).

2. J.C. Jagt, IEEE Trans. Comp. Pkg. Mfg Technol., Part A, 21, 215 (1998).

3. M. Zwolinski et al., IEEE Trans. Comp. Pkg. Mfg Technol., Part C, 19, 241 (1996).

4. Lead-Free Solder Project Final Report (Ann Arbor, MI: NCMS, 1997).

5. C. Gallagher, G. Matijasevic, and J.F. Maguire, Proc. 47th Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 1997), p. 554.

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