Interfacial reactions and phase equilibria in the Al-Cu/Ta systems-Reference-Cited by-同舟云学术

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Interfacial reactions and phase equilibria in the Al-Cu/Ta systems

Published:2006-01 Issue:1 Volume:35 Page:22-27
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chou Chin-Yi,Chen Sinn-Wen

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0179-9.pdf

Reference15 articles.

1. J.L. Stoffel, U.S. Patent 4,862,197 (1989).

2. U.E. Hess, U.S. Patent 4,719,477 (1988).

3. C.L. Wright, J.G. Bears, C.S. Chan, R.R. Hay, and F. Ura, U.S. patent 4,535,343 (1985).

4. S.P. Garg, Phase Diagrams of Binary Tantalum Alloys (Calcutta, India: Indian Institute of Metals, 1996), pp. 8–12.

5. H. Kimura, O. Nakano, and T. Ohkoshi, Trans. Nat. Res. Inst. Met. (Jpn.) 16, 1 (1973).

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Al-Ta Binary Phase Diagram Evaluation;MSI Eureka;2016-12-22

2. Experimental study and thermodynamic re-assessment of the binary Al–Ta system;Intermetallics;2010-01

3. Electrical conductivity and thermal properties of acrylonitrile-butadiene-styrene filled with multiwall carbon nanotubes;Polymer Engineering & Science;2009-08-24

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