Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection-Reference-Cited by-同舟云学术

Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Published:2008-09-16 Issue:12 Volume:37 Page:1851-1857
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Choi S.,Hwang S.Y.,Oh W.S.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0531-3.pdf

Reference11 articles.

1. I. Watanabe and K. Takemura, Conductive Adhesives for Electronics Packaging, Edited by Johan Liu, Electrochemical (Bristol England, 1999), pp. 256–271.

2. Johan Liu, Microsystem Technologies 5(2), 72(1998).

3. 3. H. Kristiansen and Johan Liu, IEEE Trans. on CPMT Part A, 21(2), 208(1998).

4. 4. Y.W. Chiu, Y.C. Chan, and S.M. Lui, Microelectronics Reliability, 42, 1945(2002).

5. C.Y. Yin, H. Lu, C. Bailey, and Y.C. Chan, Proc. 53rd ECTC (2003), p. 698.

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