Interfacial reactions in the Sn-Ag/Au couples-Reference-Cited by-同舟云学术

Interfacial reactions in the Sn-Ag/Au couples

Published:2001-09 Issue:9 Volume:30 Page:1133-1137
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Sinn-Wen,Yen Yee-Wen

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0140-x.pdf

Reference24 articles.

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3. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, and P. Cusack, An Analysis of the Current Status of Lead-Free Soldering (London: Dept. of Trade and Industry, 1999).

4. B. Richards and K. Nimmo, An Analysis of te Current Status of Lead-Free Soldering-update 2000 (London: Dept. of Trade and Industry, 2000).

5. K. Tanaka, M. Bonkohara, A. Dohya, T. Shimada, M. Tanioka, and T. Kimura, Int. J. Microcircuits and Electron. Pkg. 19, 462 (1996).

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