Interfacial Reactions in Sn/Fe-xNi Couples-Reference-Cited by-同舟云学术

Interfacial Reactions in Sn/Fe-xNi Couples

Published:2011-08-12 Issue:1 Volume:41 Page:144-152
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yen Yee-Wen,Hsiao Hsien-Ming,Lin Shih-Wei,Huang Pin-Ju,Lee Chiapyng

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-011-1727-5.pdf

Reference28 articles.

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3. R.J. Klein Wassink, Soldering in Electronics: A comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques (Ayr, Scotland: Electrochemical, 1989), p. 135.

4. W.R. Johammes and W. Johnson, Int. J. Microcircuits Electron. Packag. 17, 135 (1994).

5. D.R. Stelmak and J.I. Vesce, Natl. Electron. Packag. Prod. Conf. 1, 286 (1995).

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