The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept

Author:

Kariya Yoshiharu,Otsuka Masahisa,Plumbridge William J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. J.H. Lau, ed., Thermal Stress and Strain in Microelectronics Packaging (New York: Van Norstrand Reinhold, 1993), pp. 67–68.

2. L. Bendersky, A. Rosen, and A.K. Mukherjee, Intern. Met. Rev. 30, 1 (1985).

3. R.W. Evans and B. Wilshire, Creep of Metals and Alloys (London: The Institute of Metals, 1985), pp. 203–243.

4. K. Maruyama and H. Oikawa, Trans. ASME, J. Press. Vess. Technol. 109, 142 (1990).

5. K. Maruyama and H. Oikawa, J. Jpn. Inst. Met. 55, 189 (1991).

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