Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique-Reference-Cited by-同舟云学术

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Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique

Published:1996 Issue:16 Volume:15 Page:1457-1459
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Nyilas A.,Rehme R.,Wyrwich C.,Springer H.,Hinrichsen G.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00275305.pdf

Reference8 articles.

1. R. L. Rudkin, R. J. Jenkins and W. J. Parker, Rev. Sci. Instr. 33 (1962) 21.

2. F. C. Chen, Y. M. Poon and C. L. Choy, Polymer 18 (1977) 129.

3. I. Engeln, I. Boro and G. Hinrichsen, Polm. Bull 11 (1984) 293.

4. K. Henry and K. Coumou, Thermochim. Acta 192 (1991) 129.

5. M. Gehrig, Kunststoffe 81 (1991) 727.

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