Seed step-coverage enhancement process for a high-aspect-ratio through-silicon via using a pyrophosphate solution-Reference-Cited by-同舟云学术

Seed step-coverage enhancement process for a high-aspect-ratio through-silicon via using a pyrophosphate solution

Published:2015-06-18 Issue:4 Volume:21 Page:775-779
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Jin SangHoon,Lee DongRyul,Lee Woon Young,Lee SangYul,Lee Min Hyung

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s12540-015-4546-z.pdf

Reference12 articles.

1. T. Jiang and S. Luo, 10th Electronics Packaging Technology Conference, p.303, IEEE, Washington, D.C., USA (2008).

2. M. Sunohara, T. Tokunaga, T. Kurihara, and M. Higashi, 58th Electronic Components and Technology Conference, p.847, IEEE, Washington, D.C., USA (2008).

3. S. C. Hong, S. Kumar, D. H. Jung, W. J. Kim, and J. P. Jung, Met. Mater. Int. 19, 123 (2013).

4. M. H. Roh, J. H. Lee, J. P. Jung, and W. J. Kim, Korean J. Met. Mater. 52, 459 (2014).

5. R. Beica, C. Sharbono, and T. Ritzdorf, 58th Electronic Components and Technology Conference, p.577, IEEE, Washington, D.C., USA (2008).

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