Removal of Oxide Film and Wetting Behavior of Sn9Zn–xSiC Composite Solder on 6061 Aluminum Alloy with Activated Organic Water-Soluble Flux

Author:

Ding MinORCID,Li Shuyong,Lu Yu,Ji Zhiqiang,Wang Jian

Funder

Natural Science Foundation of Shanxi Province

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference26 articles.

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3. H. Zhang, Y. Chen, A.A. Luo, A novel aluminum surface treatment for improved bonding in magnesium/aluminum bimetallic castings. Scripta Mater. 86, 52–55 (2014)

4. L.-B.Z. Min-Bo, L. Zhou, F.-S. Zhang, X. Qiu, X.-P. Ma, Zhang, Influence of metal–oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn–0.7Cu/6061Al joints. Int. Conf. Electron. Packag. Technol. 17, 323–327 (2015)

5. L. Zhang, M.B. Zhou, F.S. Qiu, X. Ma, X.P. Zhang, Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components. Int. Conf. Electron. Packag. Technol. 17, 905–909 (2016)

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