Thermomechanical stability of memory package with LOC structure-Reference-Cited by-同舟云学术

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Thermomechanical stability of memory package with LOC structure

Published:2005-01 Issue:1 Volume:11 Page:89-93
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Lee Seong-Min

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF03027490.pdf

Reference5 articles.

1. S. M. Lee, J. H. Lee, S. Y. Oh, and H. K. Chung,45 th ECTC, p. 455,IEEE, LasVegas, NE (1995).

2. S. M. Lee and K. W. Lee,Jpn, J. Appl. Phys,35, 5462 (1996).

3. M. Lamson, D. Edwards, S. Groothuis, and G. Heinen,43 th ECTC, p. 1045, IEEE, Seattle, WA (1993).

4. S. M. Lee,Jpn. J. Appl. Phys. 41, 3860 (2004).

5. S. M. Lee,Met. Mater.-Int. 9, 489 (2003).

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1. Factors to Influence Thermal-Cycling Reliability of Passivation Layers in Semiconductor Devices Utilizing Lead-on-Chip (LOC) Die Attach Technique;Korean Journal of Materials Research;2009-05-27

2. COMPARISON OF DOSE FROM RADIOLOGICAL EXAMINATION FOR SCOLIOSIS IN CHILDREN AMONG TWO PEDIATRIC HOSPITALS BY MONTE CARLO SIMULATION;Health Physics;2008-05

3. Prevention of Dicing-Induced Damage in Semiconductor Wafers;Key Engineering Materials;2007-08

4. Filler-induced failure mechanism in plastic-encapsulated microelectronic packages;Metals and Materials International;2006-12

5. The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices;Japanese Journal of Applied Physics;2006-10-06

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