RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly-Reference-Cited by-同舟云学术

RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly

Published:2017-06-20 Issue:4 Volume:17 Page:699-705
ISSN:1547-7029
Container-title:Journal of Failure Analysis and Prevention
language:en
Short-container-title:J Fail. Anal. and Preven.

Author:

Gangidi Prashant Reddy,Souriyasak Noy

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Safety, Risk, Reliability and Quality,General Materials Science

Link

http://link.springer.com/article/10.1007/s11668-017-0296-1/fulltext.html

Reference6 articles.

1. J. Lee, Root Cause Analysis of Printed Circuit Boards (SMTA Wisconsin Chapter, 2011) https://www.smta.org/chapters/files/wisconsin_dfx-root_cause_failure_analysis_final.pdf

2. J. Savic, W. Xie, N. Islam, P.G. Oh, R. Pundse, K.O. Kim, in 2013 SMTA International Conference Proceedings. pp. 1–2

3. Z. Mei, H.A. Holder, H.A. Vander Plas, Low temperature solders. Hewlett Packard J Article 10, 2 (1996). http://www.hpl.hp.com/hpjournal/96aug/aug96a10.pdf

4. J. Hwang, Defects and failure phenomena of solder joints, in Expo SMT’88 Proceedings

5. C. Ryu, J. Hsu, L. Mendoza, A. Capuz, J. Caguiat, H. Sy, R. Lathrop, in 2008 10th Electronic Components Technology Conference (ECTC), pp. 1–2

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PCB thermal reliability characteristics analysis under ambient temperature;Journal of Computational Methods in Sciences and Engineering;2020-09-30

2. Retraction Note: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly;Journal of Failure Analysis and Prevention;2018-09-03