Developments in and Limitations of Adhesive Materials for Severe Environments and a Long Service Life

Author:

Lee Lieng-Huang

Publisher

Springer US

Reference38 articles.

1. L.H. Lee, “Recent Developments in Adhesive and Sealant Chemistry,” to be published in Adhesive Chemistry - Developments and Trends, Editor, L.H. Lee, Plenum, New York, 1984.

2. P. M. Hergenrother, “Status of High-Temperature Adhesives, ” in Ref. 1.

3. T. L. St. Clair, “Adhesive Development at NASA-Langley,” presented to the Program Review/Workshop at the Virginia Polytechnic Institute and State University, May 1, 1984.

4. . L.C. Hsu and W.H. Philipp, “Cyclopolymerization of Aromatic Nitriles and Polymers with Ring-ChainStructure Made Thereby,” presented to the IUPAC Macro Conference, University of Massachusetts, Amherst, MA, July, 1982 . Also L.C. Hsu, U.S. Patent 4,159, 262 (1979).

5. C. Arnold, Jr., “Stability of High-Temperature Polymers,” J. Polym. Sci. Macromole. Rev., 14, 265–378 (1979) .

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1. Adhesive and thermal characteristics of maleimide-functional novolac resins;Journal of Applied Polymer Science;1999-08-01

2. LATEX ACRYLIC SEALANTS;Handbook of Aluminum Bonding Technology and Data;1993-06-16

3. High Temperature Organic Adhesives—A Review;Adhesives, Sealants, and Coatings for Space and Harsh Environments;1988

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