Surface Mount Technology
Author:
Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4615-4084-7.pdf
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Chapter 6. Surface Mount Assembly of Electronic Modules;Surface Engineering and Applied Electrochemistry;2024-06
2. Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment;Surface Engineering and Applied Electrochemistry;2024-06
3. REDUCTION OF POST-PLACEMENT DEFECTS IN SURFACE MOUNT ASSEMBLY;Proceeding of Flexible Automation and Integrated Manufacturing 1998;2023
4. Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems;Sensors;2020-04-10
5. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020
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