1. Lea, C., “The Harmfulness of Re-Working Cosmetically Defective Solder Joints,” Soldering and Surface Mount Technology, 5, 1990, pp. 4–9.
2. Klein Wassink, R. J., and de Kluizenaar, E. E., “De-Wetting of Molten Solder from Copper,” Proc. Deutscher Verlag für Schweisstechnik Conference on Soldering and Welding in Electronics and Precision Mechanics, Munich, Germany; 71, 1981, pp. 16–21.
3. Keller, H. N., “Temperature Ageing of External Connections Condensation Soldered to Ti-Pd-Au Thin Films,” IEEE Trans. Components, Hybrids and Manufacturing Technology, 2, 1979, pp. 180–195.
4. Thwaites, C. J., “Solderability of Coatings for Printed Circuits,” Trans. Institute of Metal Finishing, 43, 1965, pp. 143–152.
5. Wenzel, R. N., “Resistance of Solid Surfaces to Wetting by Water,” Industrial and Engineering Chemistry, 28, 1936, pp. 988–994.