Characterization of Electronic Components by Acoustic Microscopy-Reference-Cited by-同舟云学术

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Characterization of Electronic Components by Acoustic Microscopy

Published:1996 Issue: Volume: Page:1-38
ISSN:
Container-title:Advances in Acoustic Microscopy
language:
Short-container-title:

Author:

Pfannschmidt Gabriele

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4615-5851-4_1

Reference10 articles.

1. Crean, G. M., Flannery, C. M., and Ó. Mathúna, S. C. (1995). Acoustic microscopy analysis of microelectronic interconnection and packaging technologies. In: Advances in Acoustic Microscopy, Vol. 1 (A. Briggs, ed.), Plenum Press, New York, pp. 1–48.

2. Sonoscan Prospectus on SLAM (1989).

3. Sonoscan Prospectus on SAM (1989).

4. Tilgner, R., Alpern, P., Baumann, J., Pfannschmidt, G., and Selig, O. (1994). Changing states of delamination between molding compound and chip surface: A challenge for scanning acoustic microscopy. IEEE Trans. Components Packag. Manuf. Technol. B 17(3), 442–448.

5. Pfannschmidt, G. (1992). Ultrasonic microscope investigations of die attach quality and correlations with thermal resistance. Quality and Reliability Engineering International, Vol. 8, No. 3, pp. 243–246.

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2. Nondestructive Testing;Encyclopedia of Polymer Science and Technology;2004-10-15

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