1. Anon., “Hybrid fabrication guidelines”, Circuits Manuf., 16 (9), 22–24 (1976), EEA80–9200.
2. Aramati, V. S., Bitler, J. S., Pfahnl, A. and Shiflett, C. C., “Thin-film microwave integrated circuits”, IEEE Trans. Parts, Hybrids & Packag., PHP-12 (4), 309–16 (1976), EEA80–13290.
3. Aube, G., Beland, B., Koosis, A., Leroux, A. and Richard, S., “Thick film hybrid micro-electronics”, Ingenieur, 62 (315), 3–8 (1976), French, EEA80–9202.
4. Batev, K. P., Vacev, K. D. and Mateev, A. H., “Electrochemical tin-coating of terminal tape for thin film hybrid integrated circuits”, Elektro Prom.-st. & Priborostr., 11 (2), 60–1 (1976), Bulgarian, EEA79–33156.
5. Brauer, W., Kienel, G. and Wechsung, R., “Reproducible methods for the fabrication of microwave strip lines of high precision and reliability”, Solid State Technol., 19 (12), 67–73 (1976), EEA80–13294.