1. Anon., “Can copper ceramic metalization substitute for thick film paste?”, Circuits Manuf., 16 (10), 40, (1976), EEA80–3291.
2. Antonucci, R. F. and Lahey, E.L., “Removal of potassium permanganate stain”, IBM Tech. Disclosure Bull., 21 (7), 2909 (1978).
3. Belikov, V. N., Belousenko, A. P. and Vyskrebtsev, V.P., “Metalized ceramic articles”, Patent USSR 590306, Publ. January 1978, CA88–125381.
4. DeVore, J. A., “Metallization of beryllia ceramics for microelectronic use”, Proceedings of the 13th Electrical/ Electronics Insulation Conference, 1977, p. 70–1, EEA81–14313.
5. Funari, J., Myers, F. R. and Thomson, W.G., “Flanged pin metallized ceramic substrate design”, IBM Tech. Disclosure Bull., 21 (1), 94–5 (1978).