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3. Wild, R. N., “Some Fatigue Properties of Solders and Solder Joints,” presented in Internepcon, Brighton, England, 1975.
4. Goldmann, L. S., “Geometric Optimization of Controlled Collapse Interconnections,” IBM J. Res. Develop., 13(3), 1969, pp. 251–265.
5. Tobias, P. A., N. A. Sinclair, and A. S. Van, “The Reliability of Controlled-Collapse Solder LSI Interconnections,” ISHM Proc., 1976, p. 60.