Author:
Barker Donald B.,Dasgupta Abhijit
Reference33 articles.
1. IPC-T-50, “Terms and Definitions for Interconnecting and Packaging Electronic Circuits,” The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, 1988.
2. Rudy, D. A., “The Detection of Cracks in Plated Through Holes Using Four Point Resistance Measurements,” 14th Annu. Proc., IEEE Reliability Physics Symposium, 1976, pp. 135–140.
3. Ammann, H. H., and R. W. Jocher, “Measurement of Thermomechanical Strains in Plated-Through Holes,” 14th Annu. Proc. IEEE Reliability Physics Symposium, 1976, pp. 118–120.
4. Jellison, J., “Evaluation of Multilayer Printed Wiring Boards by Metallographic Techniques,” NASA Publication 1161, May 1986.
5. Tossell, D. A., and K. H. G. Ashbee, “High Resolution Optical Interference Investigation of Deformation Due to Thermal Expansion Mismatch Around Plated Through Holes in Multilayer Circuit Boards,” J. Electronic Materials, 18 (2), 1989, pp. 275–286.
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