Interconnection
Author:
Suganuma Katsuaki
Publisher
Springer New York
Reference12 articles.
1. Suganuma K (2001) Advances in lead-free electronics soldering. Curr Opin Solid State Mater Sci 5(1):55–64
2. Suganuma K, Sakai T, Kim K-S, Takagi Y, Sugimoto J, Ueshima M (2002) Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy. IEEE Trans Electron Packag Manuf 25(4):257–261
3. Suh D, Hwang C-W, Ueshima M, Sugimoto J (2008) A novel low-temperature solder, based on intermetallic-compound phases: alloy design, high-homologous temperature properties, and reliability. JOM 62(12–13):71–76
4. Inoue M, Kawahito Y, Tada Y, Hondo T, Kawasaki T, Suganuma K, Ishiguro H (2008) A super-flexible sensor system for humanoid robots and related applications. J Jpn Inst Electron Packag 11(2):136–140
5. Wakuda D, Suganuma K (2011) Stretchable fine fiber with high conductivity fabricated by injection forming. Appl Phys Lett 98:073304