Thermal Overfill, and the Surface Vaporisation of Cryogenic Liquids under Storage Conditions-Reference-Cited by-同舟云学术

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Thermal Overfill, and the Surface Vaporisation of Cryogenic Liquids under Storage Conditions

Published:1984 Issue: Volume: Page:795-803
ISSN:
Container-title:Advances in Cryogenic Engineering
language:
Short-container-title:

Author:

Beduz C.,Rebiai R.,Scurlock R. G.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4613-9865-3_90

Reference4 articles.

1. C. Beduz, G. Beresford and R.G. Scurlock, in: “Proc. of ICEC9”, Butterworth, Guildford, England, (1983), p. 790.

2. G.C. Vliet and C.K. Liu, J. Heat Transfer, Trans ASME 91: 517 (1969), p. 517.

3. C. Beduz, R. Rebiai and R.G. Scurlock, in: “Proc. of ICEC9, “Butterworth, Guildford, England, p. 802.

4. J.C. Berg, A. Acrivos and M. Boudart, Adv. Chem. Eng.. 6:61 (1966), p. 61.

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