1. JEDEC Standard-JESD51-2 (1995) Integrated circuits thermal test method environment conditions-natural convection (still air), JEDEC Solid State Technology Association
2. JEDEC Standard-JESD51-3 (1996) Low effective thermal conductivity test board for leaded surface mount packages. Reproduced with permission from JEDEC, for the complete JEDEC Standard,
www.jedec.org
, JEDEC Solid State Technology Association
3. JEDEC standard-JESD51-7 (1999) High effective thermal conductivity test board for leaded surface mount packages, JEDEC Solid State Technology Association
4. JEDEC standard-JESD51-9 (2000) Test boards for area array surface mount package thermal measurements, JEDEC Solid State Technology Association
5. JEDEC standard-JESD51-10 (2000) Test boards for through-hole perimeter leaded package thermal measurements, JEDEC Solid State Technology Association