Author:
Lee Tae-Kyu,Bieler Thomas R.,Kim Choong-Un,Ma Hongtao
Reference32 articles.
1. Y. Kariya, C. Gagg, and W.J. Plumbridge, Tin pest in lead-free solders, Soldering and Surface Mount Technology, V. 13(1), pp. 39–40, 2000.
2. M. Kuramoto, S. Ogawa, M. Niwa, K.-S. Kim, and K. Suganuma, Die bonding for a nitride light-emitting diode by low-temperature sintering of micrometer size silver particles, IEEE Trans. Component and Packaging Technology vol. 33, no. 4, pp. 801–808, Dec. 2010.
3. J. G. Bai, Z. Z. Zhang, J. N. Calata, G.-Q. Lu, Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device- Metallized Substrate Interconnect Material, IEEE Transaction on Components and Packaging Technologies, Vol. 29, No. 3, pp.589-593, 2006.
4. S. Nakamura, T. Mukai, M. Senoh, Candela-class high-brightness InGaN/AlGaN double-heterostructure blue-light emitting diodes, Applied Physics Letters, V 64(13), pp. 1687–1689, 1994.
5. M.-H. Chang, D. Dasa, P.V. Vardea, M. Pecht, Light emitting diodes reliability review, V. 52, Issue 5, pp. 762–782 May 2012.