Solder Attachment Reliability, Accelerated Testing, and Result Evaluation

Author:

Engelmaier Werner

Publisher

Springer US

Reference43 articles.

1. Klinger, D. J., Y. Nakada, and M. A. Menendez, AT&T Reliability Manual Eds., New York, Van Nostrand Reinhold, 1990.

2. Holcomb, D. P., and J. C. North, “An Infant Mortality and Long-Term Reliability Failure Rate Model for Electronic Equipment,” AT&T Technical Journal V. 64 No. (1), 1985.

3. MIL-HDBK-217D, Military Handbook - Reliability Prediction of Electronic Equipment, January 15, 1982, Department of Defense, Washington, D.C. 20301.

4. Morrow, J. D., “Cyclic Plastic Strain Energy and Fatigue of Metals,” ASTM STP 378, ASTM, Philadelphia, PA, 1964, pp. 45–87.

5. Manson, S. S., Thermal Stress and Low Cycle Fatigue, New York, McGraw-Hill, 1966.

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