1. Shine, M. C., and L. R. Fox, “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue, ASTM STP 942, H. D. Solomon et al., Eds. Philadelphia, ASTM, 1988, pp. 588–610.
2. Solomon, H. D., “Low Cycle Fatigue of Surface Mounted Chip Carrier/Printed Wiring Board Joints,” Proceedings of 39th Electronic Components Conference, 1989, pp. 277–292.
3. Solomon, H. D., “Influence of Temperature on the Low Cycle Fatigue of Surface Mounted Chip Carrier/Printed Wiring Board Joints,” GE Information Series, September 1987.
4. Solomon, H. D., “Low-Cycle Fatigue of 60/40 Solder-Plastic Strain Limited vs. Displacement Limited Testing,” in Electronic Packaging: Materials and Processes, J. A. Sortell, Ed., ASM, 1986, pp. 29–49.
5. Solomon, H. D., “Low-Frequency, High-Temperature Low-Cycle Fatigue of 60Sn/40Pb Solder,” Low Cycle Fatigue, ASTM STP-942, H. D. Solomon et al., Eds. Philadelphia, ASTM, 1988, pp. 342–369.