1. A.E. Ruehli and H. Heeb, “Challenges and Advances in Electrical Interconnect Analysis,” Proc. 29th ACM/IEEE Design Automation Conf., pp. 460-465, 1992.
2. H.B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley: Reading, MA, 1990.
3. “Circuit Analysis, Simulation and Design,” in Advances in CAD for VLSI, Vol. 3, Part 2, (A.E. Ruehli, ed.), Elsevier: Amsterdam, 1987.
4. OptEM VLSI User’s Manual, Version 2.0, OptEM Engineering Inc., Calgary, Alberta, 1992.
5. O.A. Palusinski, A.C. Cangellaris, J.L. Prince, J.C. Liao, and L. Vakanas, “Electrical Performance of VLSI Interconnect Systems,” in Electronics Packaging Forum, Vol. 1 (J.E. Morris, ed.), Van Nostrand Reinhold, New York, 1990