1. Ackroyd, M. L., Mackay, C.A., and Thwaites, C. J. 1975. Effect of certain impurity elements on the wetting properties of 60% tin—40% lead solders. Metals Technology 2 (Pt. 2) Feb., pp. 73–85.
2. Adams, A. C. 1988. Dielectric and polysilicon film deposition. In VLSI Technology, Second Edition, ed. S. M. Sze, pp. 233–71. New York, NY: McGraw-Hill.
3. Ahmad, S. S. 1988. “Impact of residue on Al/Si pads on gold bonding,” 38th Electronic Components Conf. Proc. pp. 534–38.
4. Ahmad, S., Blish, R. II, Corbett, T., King, J., and Shirley, G. 1986. “Effect of bromine concentration in molding compounds on gold ball bonds to aluminum bonding pads,” in 36th Electronic Components Conf. Proc. May, pp. 127–31.
5. Alvarez, Antonio R., editor. 1989. BiCMOS Technology and Applications Norwell, MA: Kluwer Academic Publishers.