POID: a passive all-optical inter-rack interconnect for data-centers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Information Systems
Link
http://link.springer.com/content/pdf/10.1007/s11276-020-02476-z.pdf
Reference41 articles.
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2. Hong, Y., Hong, X., Chen, J., & He, S. (2017). Elastic all-optical multi-hop interconnection in data centers with adaptive spectrum allocation. Optics Communications, 383, 478–484.
3. Kachris, C., Kanonakis, K., & Tomkos, I. (2013). Optical interconnection networks in data centers: Recent trends and future challenges. IEEE Communications Magazine, 51(9), 39–45.
4. Liu, Y., Muppala, J. K., Veeraraghavan, M., Lin, D., & Hamdi, M. (2013). Data center network topologies: Current state-of-the-art. In Data center networks (pp. 7–14). Cham: Springer.
5. Nagarajan, R., Bhoja, S., & Issenhuth, T. (2016). 100 Gbit/s, 120 km, PAM 4 based switch to switch, layer 2 silicon photonics based optical interconnects for datacenters. In 2016 IEEE hot chips 28 symposium (HCS) (pp. 1–17). IEEE Computer Society.
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1. Optical Intra- and Inter-Rack Switching Architecture for Scalable, Low-Latency Data Center Networks;2023 IEEE Symposium on Computers and Communications (ISCC);2023-07-09
2. Collision-free distributed MAC protocol for passive optical intra-rack data center networks;Journal of Optical Communications and Networking;2022-07-28
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