Processing high critical current density Bi-2223 wires and tapes-Reference-Cited by-同舟云学术

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Processing high critical current density Bi-2223 wires and tapes

Published:1992-10 Issue:10 Volume:44 Page:54-58
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Haldar Pradeep,Motowidlo Leszek

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF03223173.pdf

Reference35 articles.

1. K. Heine, J. Tenbrink, and M. Thöner, Appl. Phys. Lett., 55 (1989), p. 2441.

2. T.H. Teifel and S. Jin, J. Appl. Phys., 70 (1991), p. 6510.

3. M. Mimura et al., Appl. Phys. Lett., 54 (1989), p. 1582.

4. K. Sato et al., IEEE Trans. Magn., 27 (1991), p. 1231.

5. Y. Yamada, B. Obst,and R. Flükiger, Supercond. Sci. Technol., 4 (1991), p. 165.

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1. Chemical cleaning treatment of textured nickel for the deposition of epitaxial thin films;Superconductor Science and Technology;2001-07-24

2. AC losses in HTSC bulk and tapes: A review;Journal of Superconductivity: Incorporating Novel Magnetism;2000

3. Fabrication of (Bi,Pb)-2223/Ag–Cu alloy sheathed tapes: optimization of Cu composition in the sheath with respect to the Cu stoichiometry in the system;Physica C: Superconductivity;1999-12

4. Flux pinning enhancement in Ag-clad Bi-2212 wires by reactive doping with barium peroxide;IEEE Transactions on Appiled Superconductivity;1999-06

5. Effects of nanosize MgO additions to bulk Bi2.1Sr1.7CaCu2Ox;Physica C: Superconductivity;1998-04

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