Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections-Reference-Cited by-同舟云学术

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Alignment-free optical modules using solder-bump-bonding technique for free-space optical interconnections

Published:2008-01 Issue:1 Volume:15 Page:19-25
ISSN:1340-6000
Container-title:Optical Review
language:en
Short-container-title:OPT REV

Author:

Miyazaki Daisuke,Ohno Yuji,Matsushita Kenji

Publisher

Springer Science and Business Media LLC

Subject

Atomic and Molecular Physics, and Optics

Link

http://link.springer.com/content/pdf/10.1007/s10043-008-0004-1.pdf

Reference26 articles.

1. J. W. Goodman, F. I. Leonberger, S.-Y. Kung, and R. A. Athale: Proc. IEEE 72 (1984) 850.

2. F. B. McCormick, F. A. P. Tooley, T. J. Cloonan, J. M. Sasian, and H. S. Hinton: Opt. Quantum Electron. 24 (1992) 465.

3. H. S. Hinton, T. J. Cloonan, F. B. McCormick, A. L. Lentine, and F. A. P. Tooley: Proc. IEEE 82 (1994) 1632.

4. N. McArdle, M. Naruse, and M. Ishikawa: IEEE J. Sel. Top. Quantum Electron. 5 (1999) 250.

5. D. Miyazaki, J. Tanida, and Y. Ichioka: Jpn. J. Appl. Phys. 29 (1990) L1550.

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