Author:
Cho Myung-Yeon,Lee Dong-Won,Ko Pil-Ju,Koo Sang-Mo,Kim Jaesik,Choi Youn-Kyu,Oh Jong-Min
Funder
Ministry of Science, ICT and Future Planning
Korea Institute of Energy Technology Evaluation and Planning
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference44 articles.
1. Bhattacharya, S.K., Tummala, R.R.: Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors. Microelectron. J. 32(1), 11–19 (2001)
2. Chahal, P., Tummala, R.R., Allen, M.G., Swaminathan, M.: A novel integrated decoupling capacitor for MCM-L technology. IEEE Trans. Compon. Packag. Manuf. Technol. Part B: 21(2), 184–193 (1998)
3. Tummala, R.R.: SOP: what is it and why? A new microsystem-integration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade. IEEE Trans. Adv. Packag. 27(2), 241–249 (2004)
4. Bhattacharya, S.K., Tummala, R.R.: Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates. J. Mater. Sci. Mater. Electron. 11(3), 253–268 (2000)
5. Lin, R.C., Lee, T.K., Wu, D.H., Lee, Y.C.: A study of thin film resistors prepared using Ni–Cr–Si–Al–Ta high entropy alloy. Adv. Mater. Sci. Eng. 2015, 1–7 (2015)
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