Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending
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Published:2023-06-19
Issue:
Volume:
Page:
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ISSN:1738-8090
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Container-title:Electronic Materials Letters
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language:en
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Short-container-title:Electron. Mater. Lett.
Author:
Lee Jong-Sung, Lee Young-Joo, Seol Jaegeun, Joo Young-Chang, Kim Byoung-JoonORCID
Funder
Ministry of Science and ICT, South Korea Ministry of Trade, Industry and Energy
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference29 articles.
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