1. E. Beyne, Proc. Electronics Packaging Technology Conference, p. 29, IEEE, Singapore, Singapore (2008).
2. J. Q. Lu, Proceedings of the IEEE, 97, 18 (2009).
3. N. Kim, D. Wu, D. Kim, A. Rahman, and P. Wu, Proc. Electronic Components and Technology Conference, p. 1160, IEEE, Orlando, USA (2011).
4. L. Cadix, M. Rousseau, C. Fuchs, P. Leduc, A. Thuaire, R. El Farhane, H. Chaabouni, R. Anciant, J.-L. Huguenin, P. Coudrain, A. Farcy, C. Bermond, N. Sillon, B. Fléchet, and P. Ancey, Proc. 2010 IEEE International Interconnect Technology Conference, p. 1, IEEE, San Francisco, USA (2010).
5. X. Sun, Q. Cui, Y. Zhu, S. Ma, J. Chen, M. Miao, and Y. Jin, Proc. Electronic System-Integration Technology Conference, p. 1, IEEE, Amsterdam, Netherlands (2012).