Electrical Performance of VLSI Interconnect Systems-Reference-Cited by-同舟云学术

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Electrical Performance of VLSI Interconnect Systems

Published:1990 Issue: Volume: Page:67-116
ISSN:
Container-title:Electronics Packaging Forum
language:
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Author:

Palusinski Olgierd A.,Cangellaris Andreas C.,Prince John L.,Liao Jen C.,Vakanas Loizos

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/978-94-010-9286-9_4.pdf

Reference36 articles.

1. T. Balph “Implementing High Speed Logic on Printed Circuit Boards” WESCON 1981, San Francisco, p. 15.

2. W.R. Blood, MECL System Design Handbook, Motorola Semi-conductor Products, Phoenix (1980).

3. A. Wexler “Computation of electromagnetic fields” Microwave Theory Tech. MTT-17 (1969) p. 416.

4. L.T. Olson “Application of the finite element method to determine the electrical resistance, inductance, capacitance parameters for the circuit package environment” IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-5 (1982) p. 486.

5. E. Yamashita “Variational method for the analysis of microstrip-like transmission lines” IEEE Trans. Microwave Theory Tech. MTT-16 (1968) p. 529.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. MODELING OF VLSI INTERCONNECT;COMPEL - The international journal for computation and mathematics in electrical and electronic engineering;1994-01

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