1. Microelectronics Packaging Handbook, R.R. Tummala and E.J. Rymaszewski, Van Nostrand Reinhold, 1989.
2. Principles of Electronic Packaging, ed., D.P. Seraphim, R.C. Lasky and C-Y. Li, McGraw-Hill, 1989.
3. Soldering in Electronics. 2nd Ed., R.J. Klein Wassink, Electrochemical Publications, Ltd., 1989.
4. Lead and Lead Alloys. W. Hoffmann, Springer-Verlag, 1970.
5. “The Attainment of Reliability in Modern Soldering Techniques for Electronic Assemblies”, C.J. Thwaites, Int’I. Met. Rev., vol. 17, 1972, pp. 149–171.