Conventional and Novel Chemical Vapor Deposition Techniques — Coating Methods to Protect Materials Against Hostile Environments-Reference-Cited by-同舟云学术

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Conventional and Novel Chemical Vapor Deposition Techniques — Coating Methods to Protect Materials Against Hostile Environments

Published:1995 Issue: Volume: Page:185-243
ISSN:
Container-title:Materials and Processes for Surface and Interface Engineering
language:
Short-container-title:

Author:

Wahl G.,Decker W.,Klippe L.,Nürnberg A.,Pulver M.,Stolle R.

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/978-94-011-0077-9_6

Reference57 articles.

1. F. Wöhler, H. Deville (1858) Ann. Chem. Pharm. 29 p. 108

2. Dekker, J.P. (1994) CVD techniques for the synthesis or modification of porous ceramics, thesis TU Delft, Prof. Schoonman

3. Powell, C.F., Oxley, J.H., Blocher, J.M. (1966) Vapor Deposition. Vol I and II, Wiley , New York, now available: Books on demand, Anne Arbor, Mi, ISBN 0–317–11088–8

4. Vossen, J.L., Kern, W. (1978 and 1991) Thin Film Processes I and II, Academic Press, New York,

5. Bunshah, R.F. (1982) Deposition Technologies for Films and Coatings, Noyes Publ. Park Ridge

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemical Vapor Deposition of Superconductor and Oxide Films;Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies;2002

2. Deposition of tungsten thin films by dual frequency inductively coupled plasma assisted CVD;Thin Solid Films;1998-11

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