Electrical Modeling of a Through Silicon Via
Author:
Publisher
Springer Netherlands
Link
http://link.springer.com/content/pdf/10.1007/978-94-017-9038-3_2
Reference25 articles.
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3. Borkar S (1999) Design challenges of technology scaling. IEEE Micro 19(4):23–29
4. Koyanagi M, Fukushima T, Tanaka T (2009) High-density through silicon vias for 3-D LSIs. Proc IEEE 97(1):49–59
5. Kim J, Cho J, Pak J, Yook J, Kim J, Kim J (2011) High-frequency through-silicon via (TSV) failure Analysis. In: IEEE 20th conference on electrical performance of electronic packaging and systems (EPEPS), 23–26 Oct 2011, pp 243–246
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