1. Aspandiar, R., Piyarali, A., and Prasad, P., 1986. “Is OA OK?” Circuits Manufacturing, April, 29-36.
2. Bellcore. 1987. TA-TSY-000078, Issue 2. “Proposed Revision of TR-TSY-000078: Generic Physical Design Requirements for Telecommunications Products and Equipment.” Red Bank, NJ: Bell Communications Research, Inc.
3. Bellcore. 1988. TR-TSY-000078, Issue 2. “Generic Physical Design Requirements for Telecommunications Products and Equipment.” Red Bank, NJ: Bell Communications Research, Inc. Berger, H. 1988. “Ultrasonic Nozzles Atomize Without Air.” Machine Design, July 21, 58-62.
4. Chan, A. S. L., and Shankhoff, T. A. 1989. “Interrelating Surface Insulation Resistance Test Patterns.” Circuit World, 15(4):34–38.
5. Chung, B.C., Cassidy, M. P., and Graham, G. W. 1983. “Evaluation of Flux Performance, Cleaning and Reliability.” The Western Electric Engineer 1:30–39.