Plasticity and Work-Hardening at 300–4.2 K of Nano-Structured Copper and Nickel Processed by Severe Plastic Deformation

Author:

Bengus V. Z.,Tabachnikova E. D.,Valiev R. Z.,Alexandrov I. V.,Natsik V. D.

Publisher

Springer Netherlands

Reference10 articles.

1. Hertzberg, R.W. (1983) Deformation and Fracture Mechanics of Engineering Materials, John Wiley & Sons, N.Y.

2. Physical Metallurgy (1983) R.W. Cahn and P. Haasen (eds.), North-Holland Physics Publish., Amsterdam.

3. Conrad, H. (1961) Role of grain boundaries in processes of creep and long-term failure, in John E. Dorn (eds.), Mechanical Behavior of Materials at Elevated Temperatures, McGraw-Hill Book Company, N. Y., pp. 96–149.

4. Akhmadeev, N.A., Valiev, R.Z., Kopylov, V.l., Mulyukov, R.R (1992) Formation of submicrograin structure in copper and nickel with a use of severe shear deformation, Metally 15, 96–101 (in Russian).

5. Gray III, G.T., Lowe, T.C., Cady, CM., Valiev, R.Z., Aleksandrov, I.V. (1997) Influence of strain rate & temperature on the mechanical response of ultrafine-grained Cu, Ni, and Al-4Cu-0.5Zr, Nanostructured Materials 9, 477–480.

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