Three-dimensional photoelasticity: stress distribution around a through thickness crack
Author:
Villarreal G.,Sih G. C.
Publisher
Springer Netherlands
Reference16 articles.
1. Post, D., ‘Photoelastic Analysis for an Edge Crack in a Tensile Field’, Proceedings of the Society for Experimental Stress Analysis, Vol. XII, No. 4, (1954) 2. Fessler, H. and Mansell, D. O., ‘Photoelastic Study of Stresses Near Cracks in Thick Plates’, Journal of Mechanical Engineering Sciences, Vol. 4, No. 3, pp. 213–225, (1962). 3. Knowles, J. K. and Wang, N. M., ‘On the Bending of an Elastic Plate Containing a Crack’, Journal of Mathematics and Physics, Vol. 39, pp. 223–236, (1961) 4. Sih, G. C., ‘Bending of a Cracked Plate with Arbitrary Stress Distribution Across the Thickness’, Journal of Engineering for Industry, Trans. ASME, Series B, Vol. 92, No. 2, pp. 350–356, (February 1970). 5. Sih, G. C., ‘A Review of the Three-Dimensional Stress Problem for a Cracked Plate’, International Journal of Fracture Mechanics, Vol. 7, No. 1, pp. 35–59, (March 1971).
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