1. Bälde, J.W., (1991) Overview of Multichip Technology, Multichip Modules: System Advantages, Major Constructions, and Materials Technologies, ed. R.W. Johnson, R.K.F. Teng, and J.W. Balde, IEEE Press, pp. 297–312, 1991.
2. Brinker, C.J. and Scherer, G.W., (1990) Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing, Academic Press..
3. Das, A., Messier, R., Gururaja, T.R. and Cross, L.E.(1986) Low Permittivity SiO2/Void in Nanocomposite Films, Electronic Packaging Materials Science II, MRS Proc. 72, pp. 27–33.
4. Yarbrough, W.A., Gururaja, T.R. and Cross, L.E. (1987) Materials for IC Packaging with Very Low Permittivity via Colloidal Sol-Gel Processing, Ceramic Bulletin
66 [4], pp. 692–698.
5. Mohideen, U., Gururaja, T.R., Cross, L.E. and Ray, R. (1988) Ultra-low Dielectric Constant Porous Silica Thick Films for High Speed IC Packaging, IEEE Trans. Comp. Hyb. Manufact. Tech.
11 [1], pp. 159–162.