Determination of Mode I and II Adhesion Toughness of Monolayer Thin Films by Circular Blister Tests
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-91989-8_38
Reference23 articles.
1. Chai, H.: Three-dimensional fracture analysis of thin-film debonding. Int. J. Fract. 46(4), 237–256 (1990)
2. Hutchinson, J.W., Thouless, M.D., Liniger, E.G.: Growth and configurational stability of circular, buckling-driven film delaminations. Acta Metall. Mater. 40(2), 295–308 (1992)
3. Jensen, H.M., Sheinman, I.: Straight-sided, buckling-driven delamination of thin films at high stress levels. Int. J. Fract. 110(4), 371–385 (2001)
4. Moon, M.W., Jensen, H.M., Hutchinson, J.W., Oh, K.H., Evans, A.G.: The characterization of telephone cord buckling of compressed thin films on substrates. J. Mech. Phys. Solids 50(11), 2355–2377 (2002)
5. Jensen, H.M., Sheinman, I.: Numerical analysis of buckling-driven delamination. Int. J. Solids Struct. 39(13–14), 3373–3386 (2002)
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