Introduction-Reference-Cited by-同舟云学术

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Introduction

Published:2014-08-23 Issue: Volume: Page:1-4
ISSN:2191-530X
Container-title:SpringerBriefs in Applied Sciences and Technology
language:
Short-container-title:

Author:

Fan Yan,Lee Poh Seng,Singh Pawan Kumar,Lee Yong Jiun

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-09647-6_1

Reference15 articles.

1. Moore GE (1965) Cramming more components onto integrated circuits. Electronics 38:114–117

2. Keyes RW (1975) Physical limits in digital electronics. Proc IEEE 63:740–766

3. Jenkins LC, Bennett A (2004) 21st century challenge: thermal management design requirements. 23rd digital avionics systems conference. DASC 04, vol 2, p 9. D. 1–7

4. Ramsey J, Jones KW, Mitra AK (2004) Thermal management solutions to advanced integrated and discrete bipolar junction (BJT) device structures. In: Proceeding of international conference of environmental system ICES 04, p 2004–2001–2572

5. Chan MA, Yap CR, Ng KC (2009) Modelling and testing of an advanced compact two-phase cooler for electronics cooling. Int J Heat Mass Transfer 52:3456–3463

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