More-than-Moore Technology Opportunities: 3D SiP
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-52548-8_3
Reference48 articles.
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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study on Thermal Shock and Annealing Behavior of Sn3Ag0.5Cu-TSV Prepared by Modified Molten Metal Infiltration Method;Journal of Electronic Materials;2022-05-11
2. Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction;Journal of Electronic Packaging;2017-06-01
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